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Articles in collected editions
Books
Conference contributions
Dissertations
Journals
Reports and books
Articles in collected editions
2011
Tegehall, P.-E. (2011). “Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to Electroless Nickel/Immersion Gold”. In The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects, Grossmann, G., and Zardini, C., eds., Springer, New York, 179-196.
Tegehall, P.-E. (2011) “Impact of Humidity and Contamination on Surface Insulation Resistance and Electrochemical Migration”. In “The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects”, Grossmann, G., and Zardini, C., eds., Springer, New York, 227-254.
2003
Tegehall, P.-E. (2003) “Reliability Verification of CSPs”, Chapter 17 in Chip-Scale Packaging for Modern Electronics, J. Fjelstad, R. Ghaffarian, Y.-G. Kim (Eds), Electrochemical Publications Limited, Isle of Man, 361-387.
Books
2011
Liu, J., Salmela, O., Särkkä, J., Morris, J.E., Tegehall, P.-E., and Andersson, C. (2011) “Reliability of Microtechnology – Interconnects, Devices and Systems”, Springer, New York.
Conference contributions
2006
Tegehall, P.-E. (2006) “Review of the Impact of Intermetallic Layers on the Risk for Brittle Fractures in Solder Joints”, The IMAPS Nordic Annual Conf. Gothenburg, 2006, 28-40.
Sun, P., Andersson, C., Liu, J., Andersson, D. R., Tegehall, P.-E. and Shangguan, D.(2006) “Evolution of Intermetallic Compounds in PBGA Sn-Ag-Cu Solder Joints during Thermal Cycling Testing”, ICEPT ’06, 7th Int. Conf. on Electronic Packaging Technology, 26-29 Aug. 2006, 760-767.
2005
Andersson, C., Andersson, D., Tegehall, P.-E. and Liu, J. (2005) "Effect of Different Temperature Cycle Profiles on the Crack propagation and Microstructural Evolution of Sn-3.8Ag-0.7Cu Solder Joints", IMAPS 2005, Brugge, Belgien, June 12-15, 523-528.
Lindgren, M., Leisner, P. and Tegehall, P.-E. (2005) “Factors influencing the surface insulation resistance”, IMAPS Nordic 2005, Tønsberg, Sep. 11-14, 2005.
2004
Andersson, C., Andersson, D., Tegehall, P.-E and Liu, J. (2004) “Effects of Different Temperature Cycle Profiles on the Crack propagation and Microstructural Evolution of Lead Free Solder Joints of Different Electronic Components”, EuroSimE 2004, Proc. of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, May 10-12, Brussels, Belgium, 2004, 455-65.
1999
Tegehall, P.-E. and Bergendahl, C.-G. (1999) “Surface Insulation Resistance Properties of Halogen-free Laminates”, Proc. International Conference on Halogen-free Materials for Electronic and Electrical Products, Gothenburg, Sweden, 1999.
1998
Tegehall, P.-E. (1998) “Impact of Contamination from Production Processes on the Reliability of Printed Board Assemblies”, Proc. International Conf. On Electronic Assembly: Materials and Process Challenges, Atlanta, 69-80, 1998.
Tegehall, P.-E. (1998) “Reliability Verification of Printed Board Assemblies: A Critical Review of Test Methods and Future Test Strategy", Invitational Paper, Proc. Surface Mount International, San José, 1998, 359-382.
1997
Boustedt, K. and Tegehall, P.-E. (1997) “The Chip Scale Packaging Task Force Users and Manufacturers Working Together”, Proc. Second International Conference on Chip Scale Packaging (CHIPCON 97), February 20 21, 1997, Sunnyvale, California, 167-170.
Rörgren, R., Tegehall, P.-E. and Carlsson, P. (1997) “Reliability of Ball Grid Array Packages in an Automotive Environment”, Proc. Surface Mount International, San José, 1997, 85-92.
Rörgren, R., Tegehall, P.-E. and Carlsson, P. (1997) “Test Methods and Reliability Evaluations of BGA Packages for Automotive Electronics”, Proc. ISHM Nordic, 1997.
1996
Carlsson, P., Rörgren, R. and Tegehall, P.-E. (1996) “Tailoring of a Test Programme for Evaluating the Reliability of Plastic Ball Grid Array Packages in Automotive Environments”, Proc. SEMICON/EUROPA '96, March 27, Geneva, 1996.
1995
Brox, B. and Tegehall, P.-E. (1995) “Reliability of Electronics in Harsh Environments”, Proc. from the SMART Group Surface Mount Conf. held in Brighton Nov. 1994, Paper B2 and Soldering & Surface Mount Technology, Nov. 21, 1995, 13-16.
Dissertations
2011
Nuthalapati, G. (2011) Diatoms for Nanomanufacturing – New Principles for Orientation and Immobilization, Master thesis, Chalmers University of Technology, Sweden.
Journals
2010
Hagfeldt , A., Boschloo , G., Sun , L., Kloo , L., Pettersson, H. (2010) ”Dye-sensitized solar cells”, Chem. Rev. 110, 6595-6663.
Pettersson, H., Gruszecki, T., Schnetz, C., Streit, M., Xu, Y., Sun, L., Gorlov, M., Kloo, L., Boschloo, G., Häggman, L., Hagfeldt, A., (2010) "Parallel-connected monolithic dye-sensitised solar modules" Progress in Photovoltaics: Research and Application 2010, 18, 340-345.
2009
Andersson, C., Vandevelde, B., Noritake, C., Sun, P., Tegehall, P.-E., Andersson, D.R., Wetter, G. and Liu, J. (2009) “Thermal Cycling of Lead-Free Sn-3.8Ag-0.7Cu 388PBGA Packages”, Soldering & Surface Mount Technology, Vol. 21, No. 2, 28-38. DOI: 10.1108/09540910910947453
2008
Andersson, C., Tegehall, P.-E., Andersson, D.R., Wetter, G. and Liu, J. (2008) “Thermal Cycling Aging Effect on the Shear Strength, Microstructure, Intermetallic Compounds (IMC) and Crack Initiation and Propagation of Reflow Soldered Sn-3.8Ag-0.7Cu and Wave Soldered Sn-3.5Ag Ceramic Chip Components”, IEEE Trans. on Components and Packaging Technologies, Vol. 31, Issue. 2, 331-344.
2007
Andersson, C., Andersson, D.R., Tegehall, P.-E. and Liu, J. (2007) “Effect of Different Temperature Cycling Profiles on the Crack Initiation and Propagation of Sn-3.5Ag Wave Solder Joints”, Microelectronics Reliability, Vol. 47, Issues 2-3, 266-272.
Fischer, A., Pettersson, H., Hagfeldt, A., Boschloo, B., Kloo, L., Gorlov, M. (2007) “Crystal formation involving 1-methylbenzimidazole in iodide/triiodide electrolytes for dye-sensitized solar cells” Solar Energy Materials and Solar Cells, 91(12), 1062-1065.
Fredin, K., Gorlov, M., Pettersson, H., Hagfeldt, A., Kloo, L., Boschloo, G. (2007) “On the Influence of Anions in Binary Ionic Liquid Electrolytes for Monolithic Dye-Sensitized Solar Cells” J. Phys. Chem. C, 111 (35), 13261–13266.
Johander, P., Tegehall, P.-E., Osman, A.A., Wetter, G. and Andersson, D. (2007) "Printed Circuit Boards for Lead-Free Soldering: Materials and Failure Mechanisms, Polymers in Electronics 2007”, Paper 11 and Circuit World, Vol. 33, No. 2, 10-16.
Kroon, J., Bakker, N.J., Smit, H.J.P., Liska, P., Thampi, K.R., Wang, P., Zakeeruddin, S.K., Grätzel, M., Hinsch, A., Hore, S., Würfel, U., Sastrawan, R., Durrant, J.R., Palomares, E., Pettersson, H., Gruszecki, T., Walter, J., Skupien, K., Tulloch, G.E. (2007) “Nanocrystalline Dye-sensitized Solar Cells Having Maximum Performance.” Progress in Photovoltaics: Research and Applications, 15, 1–18.
Pettersson, H., Gruszecki, T., Bernhard, R., Häggman, L., Gorlov, M., Boschloo, G., Edvinsson, T., Kloo, L., Hagfeldt, A. (2007) “The monolithic multicell – a tool for testing material components in dye-sensitised solar cells” Progress in Photovoltaics: Research and Application, 15, 113-121.
2005
Andrae, A. S. G., Andersson, D. R., Ramberg, C., Bengtsson, G., and Liu, J. (2005) “Application of Simplified Methods for Partial Environmental Assessment of Microelectronics Soldering Materials and Processes in Small and Medium Sized Enterprises”, Gate to Environmental and Health Sciences (Internet-Journal Gate to EHS), No. 5, May 18, 2005, 1-8.
Andrae, A. S. G., Andersson, D. R. and Liu, J. (2005) “Significance of intermediate production processes in life cycle assessment of electronic products assessed using a generic compact model.” Journal of Cleaner Production, Vol. 13, Issues 13-14, 2005, 1269-1279.
2004
Pettersson, H., Gruszecki, T., Johansson, L., Edwards, M., Hagfeldt, A., Matuszczy, T. (2004) Direct-driven electrochromic displays based on nanocrystalline electrodes, Displays 25, 223–230
2003
Pettersson, H., Gruszecki, T., Johansson, L.-H., Johander, P. (2003) “Manufacturing method for monolithic dye-sensitised solar cells permitting long-term stable low-power modules.”, Solar Energy Materials and Solar Cells, 77(4), 405-413.
2002
Edwards, M., Gruszecki, T., Pettersson, H., Thuraisingham, G., Hagfeldt, A. (2002) “A semi-empirical model for the charging and discharging of electric-paint displays”, Electrochemistry Communications, 4(12), 963-967.
2001
Edwards, M. O. M., Boschloo, G., Gruszecki, T., Pettersson, H., Sohlberg, R., Hagfeldt, A. (2001) “Electric-paint displays“ with carbon counter electrodes, Electrochim. Acta 46, 2187.
Pettersson, H., Gruszecki, T. (2001) “Long-term stability of low-power dye-sensitized solar cells prepared by industrial methods”, Sol. Energy Mater. Sol. Cells, 70, 203-212.
2000
Burnside, S., Winkel, S., Brooks, K., Shklover, V., Grätzel, M., Hinsch, A., Kinderman, A., Bradbury, C., Hagfeldt, A., Pettersson, H. (2000) “Deposition and characterization of screen-printed porous multi-layer thick film structures from semiconducting and conducting nanomaterials for use in photovoltaic devices.”, Journal of materials science: Materials in electronics, 11, 355-362.
Vrien, J., Scholtens, B., Maes, I., Graetzel, M., Winkel, S., Burnside, S., Wolf, M., Hinsch, A., Kroon, J., Ahlse, M., Tjerneld, F., Ferrero, G., Bruno, E., Hagfeldt, A., Bradbudy, C., Carlsson, P., Pettersson, H. (2000) “Negative Ames-test of cis-di(thiocyanato)-N,N'-bis(4,4'-dicarboxy-2,2'-bipyridine)Ru(II), the sensitizer dye of the nanocrystalline TiO2 solar cell”, Solar Energy Materials and Solar Cells, 60, 43-49.
1998
Tegehall, P.-E. (1998) “A Test Strategy to Verify the Reliability of Chip-Scale Packages”, Chip Scale Review, Vol. 2, No. 5, 67-75.
1997
Lindgren, M., Boustedt, K., Carlsson, P. and Tegehall, P.-E. (2007) “Influence of Contaminants from the Production Process on the Reliability of Sequential Build-up Circuit Boards”, Recent Progress in Printed Circuit Board Technology, January 1997.
1992
Tegehall, P.-E. and Dunn, B. D. (1992) "Influence of Flux Residues and Conformal Coatings on the Surface Resistance Properties of Spacecraft Circuit Boards", ESA Journal, Vol. 16, No. 3, 255-273.
1991
Tegehall, P.-E. (1991) "The Impact of Crevices beneath Surface Mounted Devices on the Cleaning Efficiency", Soldering & Surface Mount Technology, No 8, 1991, 46-52.
Reports
2006
Tegehall, P.-E. and Dunn, B. D. (2006) “Evaluation of Cleanliness Test Methods for Spacecraft PCB Assemblies”, ESA STM-275, ESA Publications Division, Noordwijk.
2005
Tegehall, P.-E. and Dunn, B. D. (2005) “Impact of Reworking Ceramic Area Array Packages on the Integrity of the Printed Board Laminate”, ESA STM-273, ESA Publications Division, Noordwijk.
Tegehall, P.-E. and Dunn, B. D. (2003) “Impact of Cracking beneath Solder Pads in Printed Board Laminate on Reliability of Solder Joints to Ceramic Ball Grid Array Packages”, ESA STM-267, ESA Publications Division, Noordwijk.
2002
Tegehall, P.-E. (2002) “Performance-based Quality Assurance of Electronic Hardware: With a Focus on Shortening the Time-to-Market”, V040098, Industrilitteratur AB, Katrineholm.
2001
Tegehall, P.-E. and Dunn, B. D. (2001) “Assessment of the Reliability of Solder Joints to Ball and Column Grid Array Packages for Space Applications”, ESA STM-266, ESA Publications Division, Noordwijk.
Tegehall, P.-E. and Dunn, B. D. (2001) “Evaluation of Thermally Conductive Adhesives as Staking Compounds during the Assembly of Spacecraft Electronics”, ESA STM-265, ESA Publications Division, Noordwijk.