Reliability of Microtechnology – Interconnects, Devices and Systems

The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.

The book also:
• Discusses the general failure mechanisms of microsystems on a component level
• Offers comprehensive coverage of solder joint reliability at the microsystems level
• Analyzes quality issues and manufacturing at the microsystems level.

Reliability of Microtechnology is an ideal volume for researchers and professional engineers working in reliability and manufacturing. The book also includes exercises and detailed solutions at the end of each chapter.

Författare: Johan Liu, Chalmers University of Technology; Olli Salmela and Jussi Särkä, Noika Siemens Network; James E. Morris, Portland State University, Per-Erik Tegehall, Swerea IVF, Cristina Andersson, Chalmers University of Technology

Nyckelord: Electrical conductive adhesives; Failure mechanisms of Microsystems; Interconnection reliability; Microsystems; Reliability for manufacturability; Reliability metrology; Reliability of Microsystems; Solder joints; System level reliability; Thermal fatigue

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