Electronics packaging
With our main focus on electronics hardware reliability we work in several areas that support product development of electronics, from development of new packaging concepts to failure analysis. Our activities include electronics packaging, manufacturing processes, process validation, reliability, testing, materials- and failure analysis, and EU-directives.
Focusing on reliable electronic hardware we work within several areas, which support design of electronics, from the development of new packaging to failure analysis. Our activities include electronics packaging, manufacturing, process validation, reliability, testing, materials and failure analysis and EU directives.
Our activities within microsystem development include fundamental studies of production and design technology for microsystems. The group's research is interdisciplinary and applies theories from physics, chemistry, mechanics, electronics and materials sciences. Research focus is directed towards fundamental analysis of processes and methods needed for the manufacture and integration of electronic, optoelectronic and micro-system components. The aim is to increase knowledge about interconnection encapsulation and packaging for micro electronics and micro system components through theoretical simulation and modelling as well as through experimental research.
We are currently running research projects in the area of solar cells and high-temperature equipment practice for GaN sensors and SiC power electronics. We are continuing our activities within lead free soldering and are now investigating brittle fractures in lead free solder joints in collaboration with Swerea KIMAB. In a newly started project, we are investigating the technical performance of electronics which use non-brominated flame retardant substances.
Legislation in regard to the environment often includes forced process changes for manufacturing companies. By monitoring the EU directives which affect the electronics industry and proactively pursuing research to find the best technical solutions, we give our customers an advantage over the competition. Research projects are converted into technical dissemination early on to create a maximum industrial benefit. One good example is the area of lead free soldering, where we have built up a comprehensive knowledge over the last ten years, which has been disseminated to the electronics industry through courses and seminars.